MarketPulse

advanced packaging

9 articles
BenzingaBenzinga··Anusuya Lahiri

Applied Materials Bolsters AI Chip Strategy With NEXX Acquisition From ASMPT

Applied Materials acquires NEXX from ASMPT to expand AI chip packaging capabilities. Stock gains 0.47% premarket ahead of May 2026 earnings.
AMATASMVYearningstechnical analysis
The Motley FoolThe Motley Fool··Geoffrey Seiler

TSMC at Crossroads: AI Boom Champion or Overvalued Capex Trap?

TSMC dominates AI chip manufacturing but faces valuation concerns at 25.5x forward P/E amid capex risks and competitive threats from Samsung and Intel.
NVDATSMINTCASMLcapital expenditureAI infrastructure
GlobeNewswire Inc.GlobeNewswire Inc.··Na

Applied Materials Acquires NEXX to Strengthen AI Chip Packaging Leadership

Applied Materials acquires NEXX from ASMPT to expand advanced packaging equipment portfolio for AI chip manufacturers using chiplet designs and large substrates.
AMATASMVYacquisitionAI accelerators
BenzingaBenzinga··Erica Kollmann

Amkor Stock Surges on Beat-and-Raise Q1 Results, Lifts Guidance

Amkor Technology ($AMKR) topped Q1 earnings estimates and raised Q2 guidance, driving stock up 0.94% to $76.30 in extended trading.
AMKRrevenue growthguidance
Investing.comInvesting.com··Jeffrey Neal Johnson

Intel Surges on $25B Terafab AI Deal, Signals Foundry Strategy Vindication

Intel surges 4% after securing $25 billion Terafab AI chip partnership with SpaceX, Tesla, and xAI, validating foundry strategy and reversing negative sentiment.
AMZNGOOGGOOGLTSMTSLA+1institutional investmentAI chip manufacturing
BenzingaBenzinga··Bamboo Works

Chinese Chipmaking Tool Maker Circuit Fabology Eyes Hong Kong IPO

Chinese lithography equipment maker Circuit Fabology files for Hong Kong IPO after posting 47.6% revenue growth, but faces persistent cash flow challenges.
KLACASMVYsemiconductor industryadvanced packaging
GlobeNewswire Inc.GlobeNewswire Inc.··Na

Adeia and UMC Deepen Hybrid Bonding Partnership to Capitalize on AI-Driven Chiplet Boom

Adeia and UMC expand IP licensing partnership, granting UMC access to hybrid bonding and 3D integration technologies crucial for AI-driven chiplet architectures.
ADEAUMCsemiconductorAI accelerators
GlobeNewswire Inc.GlobeNewswire Inc.··Na

Applied Materials and SK hynix Partner on AI Memory Innovation at Silicon Valley R&D Hub

Applied Materials and SK hynix launch long-term collaboration to develop next-gen AI memory at EPIC Center, backed by $5B R&D investment.
AMATDRAMhigh-bandwidth memory (HBM)
The Motley FoolThe Motley Fool··Manali Pradhan, Cfa

AI Infrastructure Spending Surge Expected to Drive Semiconductor Equipment Demand Through 2026

AI spending projected at $2.5 trillion with $600B in capex driving semiconductor equipment demand through 2026, benefiting Nvidia, TSMC, and Applied Materials.
NVDAAMDTSMAMATcapital expenditureAI infrastructure