MarketPulse

advanced packaging

4 articles
BenzingaBenzinga··Bamboo Works

Chinese Chipmaking Tool Maker Circuit Fabology Eyes Hong Kong IPO

Chinese lithography equipment maker Circuit Fabology files for Hong Kong IPO after posting 47.6% revenue growth, but faces persistent cash flow challenges.
KLACASMVYsemiconductor industryadvanced packaging
GlobeNewswire Inc.GlobeNewswire Inc.··Na

Adeia and UMC Deepen Hybrid Bonding Partnership to Capitalize on AI-Driven Chiplet Boom

Adeia and UMC expand IP licensing partnership, granting UMC access to hybrid bonding and 3D integration technologies crucial for AI-driven chiplet architectures.
ADEAUMCsemiconductorAI accelerators
GlobeNewswire Inc.GlobeNewswire Inc.··Na

Applied Materials and SK hynix Partner on AI Memory Innovation at Silicon Valley R&D Hub

Applied Materials and SK hynix launch long-term collaboration to develop next-gen AI memory at EPIC Center, backed by $5B R&D investment.
AMATDRAMhigh-bandwidth memory (HBM)
The Motley FoolThe Motley Fool··Manali Pradhan, Cfa

AI Infrastructure Spending Surge Expected to Drive Semiconductor Equipment Demand Through 2026

AI spending projected at $2.5 trillion with $600B in capex driving semiconductor equipment demand through 2026, benefiting Nvidia, TSMC, and Applied Materials.
NVDAAMDTSMAMATcapital expenditureAI infrastructure